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Manufacturing Challenges in Wide Band Gap (WBG) Power Electronics

机译:宽带隙(WBG)电力电子制造挑战

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Wide Band Gap (WBG) semiconductors, Silicon Carbide (SiC) and Gallium Nitride (GaN), have enormous potential for transformative impact on electric utility and transportation infrastructures. However, commercialization of WBG power electronics switching devices has been slow primarily due to high cost and unproven field-reliability. This paper reviews the manufacturing challenges facing the WBG power electronics industry in order to "unlock" the true potential of this "game changing" solid-state energy conversion technology.
机译:宽带隙(WBG)半导体,碳化硅(SiC)和氮化镓(GaN),对电力和运输基础设施的转化影响具有巨大潜力。然而,由于高成本和未经证实的现场可靠性,WBG电力电子切换装置的商业化主要是较慢的。本文综述了WBG电力电子行业面临的制造挑战,以“解锁”这种“淘汰”固态能源转换技术的真正潜力。

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