Research on Curing Mechanism of Bisphenol-A Epoxy Resin by DSC

摘要

Curing reaction of bisphenol-A epoxy resin were researched by non-isothermal DSC. The experiment result showed that the cured structure were excellent when the proportion between the bisphenol-A epoxy resin DER331 and curing agent DEH622 was 100:30, the reaction heat was 358.53 J/g which is 4 to 9 times higher than the heat released by other different ratios. Initial curing temperature was 36.35°C which is the lowest among all different ratios, curing peak temperature was lower 10°C to 40°C than other proportion. Thus, optimum proportion between the DER331 epoxy resin and the DEH622 curing agent is 100:30.