HIGHER DENSITY POP SEMICONDUCTOR PACKAGING SOLUTION: BRIDGING THE INFRASTRUCTURE GAP BETWEEN WIRE-BOND AND TSV INTERCONNECT

摘要

The challenge for today's mobile devices is that they all need to support more advanced graphics processing. And to support this factor the industry requires an exponential increase in processor-to-memory bandwidth. This paper will introduce two innovative semiconductor package technologies designed to address these challenges; the Bond-Via-Array (BVA) package, an ultra high-I/O Package-on-Package (PoP) solution and the xFD package assembly process, a very low profile stacked-die memory variation developed for high performance DRAM.