EVALUATION OF STENCIL TECHNOLOGY FOR MINIATURIZATION

摘要

Miniature components are ubiquitous and require repeatable solder paste depositions to ensure a reliable interconnect and minimize rework. The objective of this study is to assess the impact of various stencil materials and fabrication methods on the repeatability of solder paste deposition. A test was designed to assess the performance of 18 different stencils, submitted by 6 different suppliers, using a variety of materials, coatings, and fabrication methods. Performance metrics include stencil aperture accuracy and topography, along with print volume repeatability and transfer efficiency for 0.4mm and 0.3 mm pitch BGAs and 0201 components with area ratios in the challenging range of 0.45 to 0.70.