Cluster Model of SHS Propagation in Cu/Sn System

机译：CU / SN系统中SHS传播的集群模型

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摘要

SHS products in Cu/Sn films have been investigated. New BCC Cu/Sn phase has been found. The scheme which illustrates transition of the FCC-lattice of copper and a tin HCP-lattice to system of octahedrons of a new phase with BCC lattice has been offered.

机译：已经研究了Cu / Sn薄膜中的SHS产品。已找到新的BCC Cu / Sn阶段。提供了通过BCC晶格的新阶段转变为FCC-铜和锡HCP-晶片的转变的方案。

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《International Scientific Practical Conference with Elements of School for Junior Scientists》|2013年||共4页
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作者
A. V. Tsibart; Yu. A. Orlova; L. I. Kveglis; V. A. Plotnikov;
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原文格式 PDF
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中图分类 TB3-53;
关键词
Crystal structure; Electron methods; New phase Su-Sn;

机译：晶体结构;电子方法;新阶段SU-SN;

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专利

1. A Bronze Matryoshka: The Discrete Intermetalloid Cluster [Sn@Cu_(12)@Sn_(20)]~(12-) in the Ternary Phases A_(12)Cu_(20)Sn_(21) (A = Na, K) [J] . Saskia Stegmaier, Thomas F. Fassler Journal of the American Chemical Society . 2011,第49期

机译：一枚青铜娃：三元相A_（12）Cu_（20）Sn_（21）中的离散金属间簇[Sn @ Cu_（12）@Sn_（20）]〜（12-）（A = Na，K）
2. Multiscale Modeling of the Interfacial Fracture Behavior in the Sn-Cu-6 Sn-5-Cu System [J] . Fei HY, Yazzie K, Williams J, Journal of computational and theoretical nanoscience . 2011,第5期

机译：Sn-Cu-6 Sn-5-Cu体系中界面断裂行为的多尺度建模
3. Chemical vapour transport of intermetallic systems. 7. Chemical transport of Ni3Ge, Ni5Ge3, Ni(Ge)-mixed crystal, CoSn, Co3Sn2, Cu41Sn11 (delta-phase), Cu10Sn3 (zeta-phase), and Cu(Sn)-mixed crystals [German] [J] . Gerighausen S., Binnewies M., Wartchow R. Zeitschrift fur Anorganische und Allgemeine Chemie . 1998,第6期

机译：金属间体系的化学蒸气传输。 7. Ni3Ge，Ni5Ge3，Ni（Ge）混合晶体，CoSn，Co3Sn2，Cu41Sn11（δ相），Cu10Sn3（ζ相）和Cu（Sn）混合晶体的化学迁移[德语]
4. Cluster Model of SHS Propagation in Cu/Sn System [C] . A. V. Tsibart, Yu. A. Orlova, L. I. Kveglis, International Scientific Practical Conference with Elements of School for Junior Scientists . 2013

机译：Cu / Sn系统中SHS传播的集群模型
5. Characterization and Modeling of the Failure Mechanism of Copper-Tin (Cu-Sn) Intermetallic Compounds in Lead-free Solder Joints. [D] . Yang, Chaoran. 2015

机译：无铅焊点中铜锡（Cu-Sn）金属间化合物失效机理的表征和建模。
6. Sn–Ag–Cu nanosolders: Melting behavior and phase diagram prediction in the Sn-rich corner of the ternary system [O] . Ali Roshanghias, Jan Vrestal, Andriy Yakymovych, -1

机译：Sn-Ag-Cu纳米焊料：三元系统富锡角中的熔融行为和相图预测
7. Phase-field modelling coupled with micro-elasticity applied to ageing in Sn-Cu/Cu and Sn-Ag-Cu/Cu lead-free solder joints [O] . Durga A, Wollants Patrick, Moelans Nele 2012

机译：相场建模与微弹性相结合，适用于Sn-Cu / Cu和Sn-Ag-Cu / Cu无铅焊点的时效
8. Thermodynamic Description of Systems Cu-Al-Sn, Cu-Al-Zn and Cu-Sn-Zn in the Copper=Rich corner of the Systems. [R] . Miettinen, J. 2000

机译：系统的铜=富集角中的Cu-al-sn，Cu-al-Zn和Cu-sn-Zn系统的热力学描述。

Cluster Model of SHS Propagation in Cu/Sn System

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