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HEAT TRANSFER MODELLING OF ENCAPSULATED PHASE CHANGE MATERIALS FOR FOOD PACKAGING

机译:食品包装封装相变材料的传热建模

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Temperature abuses in cold chain can lead to deterioration in food quality and safety. Packaging can play an active role in temperature controlling of perishable products. However, standard materials for product packaging (plastic, cardboard or wood) usually have limited thermal buffering capacity. One possible approach to enhance this capacity and maintain the product at a desired temperature is thermal energy storage by phase change materials - PCM. In the present work, the heat transfer behaviour of a plate made from encapsulated PCM (Rubitherm RT5 encapsulated in polycaprolactone PCL) was studied. The enthalpy method was chosen to model the phase transition of the PCM. The model was validated by experimental cooling and heating processes, under controlled air temperature conditions. The numerical result demonstrated a better thermal capacitance of the encapsulated PCM material compared to a standard one (cardboard).
机译:冷链中的温度滥用可能导致食品质量和安全性劣化。包装可以在易腐烂产品的温度控制中发挥积极作用。但是,产品包装(塑料,纸板或木材)的标准材料通常具有有限的热缓冲能力。通过相变材料 - PCM,一种可能的方法可以在所需温度下加强该容量并维持产品的方法是热能存储器。在本作工作中,研究了由封装的PCM制成的板的传热行为(封装在聚己内酯PCL中的Rubitherm RT5)。选择焓方法以模拟PCM的相位转变。通过实验冷却和加热过程验证该模型,在受控的空气温度条件下进行验证。与标准一(纸板)相比,数值结果证明了封装的PCM材料的更好的热电容。

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