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Solid State Bonding of CuCrZr to Duplex Stainless Steel

机译:CUCRZR的固态键合双相不锈钢

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摘要

In the solid state bonding, joint are made by pressing surfaces together at high temperature so that a bond grows across the interface by atomic diffusion. In order to satisfy both requirements of thermal and mechanical properties of aerospace vehicle, conductive CuCrZr alloy was bonded to duplex steel with high strength. Solid state bonding was performed at 3 different pressure conditions and at temperatures of 850°C and 950°C. Microstructural and mechanical evaluation was performed to obtain the optimum joining condition.
机译:在固态粘合中,通过在高温下将表面压在一起,使得粘合通过原子扩散在界面上生长。为了满足航空航天载体的热量和力学性能的两个要求,具有高强度的双相钢键合的导电CucrZR合金。固态键合在3种不同的压力条件下和850℃和950℃的温度下进行。进行微观结构和机械评估以获得最佳的连接条件。

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