Temperature Analysis for Circumferential Electric Discharge Milling and Mechanical Grinding Compound Machining of SiC Ceramic

摘要

Engineering ceramics have been widely employed in the aerospace, automotive and tool field. However, they are difficult to machine due to their high hardness and brittleness. Circumferential electric discharge milling and mechanical grinding compound machining method is employed in this paper. The temperature distribution model for the compound machining of SiC ceramic is established, and the temperature distribution is calculated at different machining conditions. The results show that with the compound machining method, the higher material removal rate can be obtained at rough machining condition, and the better machined surface quality can be obtained at finish machining condition.