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Stability of solid/liquid interface of Pb-80wtSn alloy under direct current during directional solidification

机译:定向凝固过程中PB-80wt%Sn合金固体/液面界面的稳定性

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The effect of medium-density current on the morphological stability of S/L interface of Pb-80wt%Sn alloy during directional solidification was investigated. The results indicated that both the DC of positive and negative 200 Acm~(-2) could decrease the critical growth rate of cellular/dendrite transition and minish the range of growth rate of cellular crystal. DC accelerated the microstructure transition from cellular crystal to dendrite crystal at the same pulling rate. Furthermore, the dendrite crystal was refined by positive and negative DC at high pulling rate. The effect of direction of DC to the microstructure transition could be neglected. In conclusion, the positive and negative 200 Acm~(-2) decreased the stability of solid/liquid interface of Pb-80% Sn alloy, and the lower the pulling rate was applied, the more obviously DC affected the microstructure.
机译:研究了中密度电流对定向凝固过程中Pb-80wt%Sn合金的S / L界面形态稳定性的影响。结果表明,阳性和负200 acm〜(-2)的直流可以降低细胞/树突过渡的临界生长速率,并咀嚼细胞晶体的生长速率范围。直流以相同的拉伸速率加速从蜂窝晶体到枝晶晶的微观结构转变。此外,树枝状晶体以高拉伸速率通过正和阴性DC精制。可以忽略DC方向对微结构转变的影响。总之,阳性和负200 acm〜(-2)降低了Pb-80%Sn合金的固体/液界面的稳定性,施加拉率越低,DC越明显影响了微观结构。

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