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The Corrosion Behavior of Cu-Ni-Si alloy in Sea Water with Deep-Sea Bacteria

机译:海水与深海细菌铜镍合金的腐蚀行为

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The corrosion behavior of Cu-Ni-Si alloy exposed to a nutrient-rich simulated seawater-based nutrient-rich medium in the presence of a deep-sea bacterial {Erythrobacter pelagi sp.nov) was investigated by metallographic microstructure observation, electrochemical impedance spectroscopy (EIS) measurement. It was demonstrated that the charge transfer resistance (Rct) and the resistance of oxide film(Rf) dramatically increased within 2 Days then gradually decrease and becoming stable because of an patchy or blotchy biofilm formed on the surface of the alloy.
机译:通过金相微观结构观察,电化学阻抗光谱研究,研究了Cu-Ni-Si合金暴露于富含富含富含富含模拟的海水的营养丰富培养基的腐蚀行为,电化学阻抗光谱法(EIS)测量。结果证明,由于在合金表面上形成的斑块或斑块生物膜,氧化膜(RCT)和氧化膜(RF)的电阻在2天内逐渐降低并变得稳定。

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