Evaluation of Thermal Diffusivity of Cross-Linked Liquid Crystalline Polyimides with Siloxane Units

摘要

Recent integration, miniaturization, and high functionalization in electronics are rapidly progressing, where both conductors and insulating materials have been packaged as densely as possible. The low thermal conductivity of insulating polymers yields a large temperature rise and gradient in devices that causes electric connection failure and reduces the lifetime of these devices. Therefore, thermoconductive polymers which can release generated heat effectively are required in semiconductors as electric insulators. To increase thermal conductivity, highly oriented polymers, that is, liquid crystalline (LC) polymers, are effective candidates.