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The Thermal Budget of Hydrogen-related Donor Profiles: Diffusion-limited Activation and Thermal Dissociation

机译:氢相关供体谱的热预算:扩散限制活化和热解离

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The impact of the thermal budget on hydrogen-related donor profiles in high purity silicon implanted with protons in the energy range of MeV is investigated. The appearance of the donor profiles is limited to the annealing temperature regime between about 350 °C and 500 °C. The activation of the doping profiles is limited by the diffusion of the implanted hydrogen from the end-of-range region throughout the radiation-induced damage. This formation process of the profiles is adequately described by a diffusion model with an effective activation energy of 1.2 eV. The hydrogen-related donors are radiation-induced defect complexes decorated by the implanted hydrogen. The thermal stability of these donors is limited by their dissociation. The deactivation of the doping is modeled by two hydrogen-related donor species with effective dissociation energies of 2.5 eV and 3 eV. The formation and dissociation mechanisms described in the present study define the upper and lower limits of the post-implantation thermal budget, respectively, for the sensible use of proton implantation doping in crystalline Silicon.
机译:研究了热预算对植入MEV能量范围内植入质子的高纯度硅中的氢相关供体谱的影响。供体型材的外观限于在约350℃和500℃之间的退火温度调节。掺杂型材的激活受到在整个辐射诱导的损伤的范围内区域的植入氢的扩散的限制。该曲线的该形成过程通过扩散模型充分描述,该扩散模型具有1.2eV的有效激活能量。氢相关的供体是辐射诱导的缺陷复合物,由植入氢气装饰。这些供体的热稳定性受其解离的限制。掺杂的失活由两个氢相关的供体物种建模,其中有效的2.5eV和3eV的有效解离能。本研究中描述的形成和解离机制分别限定了植入后热预算的上限和下限,以便在晶体硅中的质子植入掺杂的明智使用。

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