首页> 外文会议>International Conference Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components >Pitfalls by applying pulsed EMC ESD System Level Stress Requirements to On-Chip Protection Design by Automotive Examples
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Pitfalls by applying pulsed EMC ESD System Level Stress Requirements to On-Chip Protection Design by Automotive Examples

机译:通过汽车示例将脉冲EMC和ESD系统水平应力要求应用于片上保护设计的陷阱

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A "SMART" system takes more than just plugging together single smart components, especially in case of ESD and EMC robust systems. In the automotive industry, this component vs. system approach is very present. The trend is going towards handing-over system-requirements down to components for several reasons. But by violating the border from a functional system to unpowered components, you can get easily being trapped by some surprising pitfalls. Based on automotive examples we provide an overview about the nature of pulsed stress conditions, simulation, modelling and advanced analysis methods. We would like to raise the awareness, that size does not always matter, and "ESD" only is not necessarily the root cause of ESD (device) failures.
机译:“智能”系统仅需要堵塞单个智能组件,特别是在ESD和EMC稳健的系统的情况下。在汽车行业中,这个组件与系统方法非常出现。有几个原因,该趋势将朝向零件到组件的系统要求。但是,通过违反功能系统的边界,无法轻易被一些令人惊讶的陷阱被困。基于汽车示例,我们提供关于脉冲应力条件,仿真,建模和高级分析方法的性质的概述。我们要提高意识,那种规模并不总是重要,“ESD”只不一定是ESD(设备)失败的根本原因。

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