首页> 外文会议>Electronics System-Integration Technology Conference >Nano-porous structure control under electrodeposition and dealloying conditions for low-temperature bonding
【24h】

Nano-porous structure control under electrodeposition and dealloying conditions for low-temperature bonding

机译:电沉积下纳米多孔结构控制和低温粘合的造成造影条件

获取原文

摘要

We investigated a low-temperature bond formation process, wherein nanoporous structures were formed on electrode surfaces by electrodeposition and dealloying. The morphology control of a nanoporous Au-Ag structure was investigated using electrochemical deposition and electrochemical methods. The ligament size of the electrodeposited Au-Ag films after dealloying increased upon annealing. The ligament size of 10-20 nm for as-deposited increased to 50-100 nm for films annealed at 150 °C. The samples that were annealed at 50 °C before dealloying indicated a finer nanoporous structure, which corresponded to the highest bond strength of the evaluated samples. The volume of selective dissolution was small on as-deposited samples despite the anodic current being the largest of the examined films. Inductively coupled plasma mass spectrometry (ICP-MS) analysis showed that the change of the Ag content of the films after dealloying of as-deposited samples was the smallest of the examined films. Small ligament size with a finer nanoporous structure resulted in high bond strength.
机译:我们研究的低温键形成方法,其中,通过电沉积和脱合金的纳米多孔形成结构进行了在电极表面上。使用电化学沉积和电化学方法的纳米多孔金 - 银结构的形态控制进行了研究。后的电沉积金 - 银膜的韧带大小在退火时的脱合金增加。为10〜20nm的韧带尺寸为沉积态增加至50-100纳米,在150℃下退火的膜。在脱合金之前50℃下进行退火,样品所指示的更精细的纳米多孔结构,其对应于所述评估的样本的最高的粘合强度。尽管阳极电流是最大的所检查的膜的选择性溶解的体积是在所沉积的样品小。电感耦合等离子体质谱(ICP-MS)分析表明,膜中的Ag含量的如此沉积的样品的脱合金后的变化是最小的所检查的膜。小尺寸韧带以更细的纳米多孔结构导致粘结强度高。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号