conductive adhesives; failure analysis; fracture mechanics; fracture toughness; integrated circuit reliability; relaxation; semiconductor technology; μMMT; DMA; ICA; cohesive zone modeling; critical energy release rate; critical interface fracture data; dynamic mechanical analysis; electrically conductive adhesive; epoxy based die attach material; failure modeling; interfacial fracture toughness characterization; isotropic conductive adhesive; lifetime prediction; material characterization; measurement method; microelectronic industry; micromixed mode tester; relaxation experiment; semiconductor technology; viscoelastic material model; Analytical models; Force; Frequency measurement; Materials; Polynomials; Strain; Temperature measurement;
机译:表征微电子封装中填充环氧膜断裂韧性的新方法
机译:热塑性/玻璃界面混合模式韧性的断裂力学表征(脆性/延性界面混合模式断裂)
机译:表征微电子包装的界面断裂韧性
机译:DMA中微电子工业胶粘剂的表征和界面断裂韧性表征的弛豫实验—难题和解决方案
机译:大环聚苯乙烯与线性聚苯乙烯共混物的表面弛豫和界面偏析的合成与表征
机译:用抗氧化剂处理的通用胶粘剂体系的界面断裂韧性
机译:薄膜系统中断裂分析和界面韧性表征的平滑数值方法的发展