首页> 外文会议>IEEE International Workshop on Low Temperature Bonding for 3D Integration >Fabrication of miniaturized polarization sensors using flip-chip bonding with atmospheric-pressure plasma activation
【24h】

Fabrication of miniaturized polarization sensors using flip-chip bonding with atmospheric-pressure plasma activation

机译:使用倒装芯片粘接与大气压等离子体激活的小型化偏振传感器的制造

获取原文

摘要

An ultra-small polarization sensor integrated with aluminum wire-grid polarizers has been developed for a compact optical rotary encoder. Flip-chip bonding using atmospheric-pressure plasma activation with mixed gas of Ar and H2 at a relatively low bonding temperature of 150 °C was applied to fabricate the integrated sensors. The feasibility of rotational angle measurement of a linear polarizer was demonstrated using the fabricated sensors.
机译:已经为紧凑的光学旋转编码器开发了与铝线栅极偏振器一体的超小型偏振传感器。使用在150℃的相对较低的Ar和H 2的混合气体中使用大气压等离子体激活的倒装芯片键合,以制造集成传感器。使用制造的传感器对线性偏振器进行旋转角度测量的可行性。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号