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Size limitations and wear behavior of TiB2 coated micro end mills (Φ < 50 μm) when machining cp-titanium

机译:加工CP钛时TIB2涂层微末端铣刀(φ<50μm)的尺寸限制和磨损行为

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Today, medical, biochemical or personal devices are often micro structured to enhance their functionality. Examples for these functionalized products are micro reactors, telecommunication systems or anti-counterfeiting devices. For the mass production of these micro structures, processes like LiGA (lithography, electroplating, and molding) or laser are well established, but the economic high quality manufacturing of protoypes or small batches is still challenging. Among others, micro milling is one of the most promising processes to fulfill those demands. However, this process is limited by the wear behavior of the tools. Due to size effects and the consequential high amount of abrasive wear of the micro end mills, structure sizes as well as the machining speed and accuracy are limited. The cutting edges of the micro end mills are subject to a high amount of abrasive wear. This is due to the high r_β/h-ratio (cutting edge radius to chip thickness ratio), resulting in a high amount of ploughing. This could be compensated by using sharper tools (lower r_β). However, the cutting edge radius is typically in the dimension of the grain size of the cemented carbide used as tool blanks and can therefore currently not be further reduced. As an alternative to lower the wear, micro end mills can be coated. In this research article, micro end mills with a diameter smaller than 50 μm were coated with a Titanium Di-Boride coating (TiB_2). The layer hardness is aprox. 4,000 HV and the B_2 in the coating reduces the friction while machining. The resulting wear behavior of the coated micro end mills is examined and the minimal tool diameter, where coating and machining is still possible, is determined. Furthermore, four different tool diameters and the respective ideal TiB_2 layer thickness were researched. Thus, the manufacturing of even smaller geometries and parts with better functionality on larger areas with a micro milling process will be possible.
机译:如今,医疗,生化或个人设备通常是微型结构化,以提高其功能。这些官能化产品的实例是微量反应器,电信系统或防伪装置。对于这些微结构的批量生产,LIGA(光刻,电镀和模塑)或激光等工艺得到了明确的,但经济高质量的蛋白质或小批量制造仍然具有挑战性。其中,微铣是满足这些需求的最有希望的过程之一。然而,该过程受工具的磨损行为的限制。由于尺寸效应和微终铣刀的后续高量磨料,结构尺寸以及加工速度和精度有限。微端铣刀的切削刃受到高量的研磨磨损。这是由于高r_β/ h比(切削刃半径到芯片厚度比),导致大量耕作。这可以通过使用更清晰的工具(较低的R_β)来补偿。然而,切削刃半径通常在用作刀具坯料的粘合碳化物的晶粒尺寸的尺寸中,因此可以不再进一步降低。作为降低磨损的替代方案,可以涂覆微端铣刀。在本研究制品中,用直径小于50μm的微端铣刀涂覆钛二硼化钛涂层(TIB_2)。层硬度是Aprox。涂层中的4,000 HV和B_2在加工时降低了摩擦。确定了涂覆的微端铣刀的所得到的磨损行为,并且确定涂覆和加工的最小工具直径仍然可以。此外,研究了四种不同的刀具直径和相应的理想TIB_2层厚度。因此,可以实现甚至较小的几何形状和具有微型铣削过程的较大区域上具有更好功能的较小几何形状的制造。

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