EMI Shielding and Antenna Solutions for System in Package

摘要

SiP Technology - Package Level Shielding & Antenna on Package 1. ASE Group has performed R&D and investing in SiP over the past 8 years: - apply package level technology to improve system board level issues. 2. Two Key Areas: - Conformal & Compartment Shielding solutions; - Antenna on Package (for connectivity applications). 3. These solutions can enable a combination of improved SiP product performance, reaching lower cost v.s. system board based conventional solutions. 4. Time to market: SiP module can be plug and play, allows quick integration and minimizing initial development risks and time. 5. RF Expertise: Complete SiP module design solutions. 6. Certification and Final Test.