Graphene-CNT Hybrid Material as Potential Thermal Solution in Electronics Applications

摘要

Graphene and CNT have great potential in electronics applications. This work explored the possibility of integrating ID CNT and 2D graphene into a 3D covalently bonded structure, i.e. a graphene-CNT hybrid material for thermal management application. The graphene-CNT hybrid material was later investigated morphologically and thermally to observe its heat dissipation capability.