Use of silver-coated polymer particles in isotropic conductive adhesives for electronics applications

摘要

An isotropic conductive adhesive based on silver-coated polymer particles has been characterized and tested. Such particles typically reduce the amount of silver in the final adhesive by more than one order of magnitude, while maintaining a good electricial conductivity. Differernt silver coating thicknesses have been tested and characterized. A silicon chip has been mounted into ceramic package, applying the conductive adhesive by a jet-printing process. The final assembly has been exposed to thermal shock cycling and humidity exposure.