Thermomechanical comparison of novel embedded high-power packages using FEM-simulations

摘要

This work investigates different methods for the contacting and attachment of the silicon die in a D~2PAK compatible, novel embedded high-power package and the mechanical stress distribution therein. The stress contributions of the steps in the manufacturing process are considered and the performance at -50°C and 150°C evaluated. Additionally, the influence of the actual mounting of the device on a PCB is investigated and pro and cons of the different solutions compared.