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Metal grain suppression and DOI capture rate improvement in 32 nm technology node

机译:金属晶粒抑制和32个NM技术节点的捕获率改进

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• Advanced Bright Field Inspection Tools: Advanced bright field Inspection tools can provide better WPH, less time to setup recipes, higher sensitivities benefits. However, metal grains suppression still a big challenge for inspection. • Metal Grain Suppression : Series methodologies for suppressing metal grain are demonstrated, it indicated that metal grains suppression can not fulfill by single methodology. It needs to find out the feasible light source and optimized one step tuning scan segment threshold setting, and furthermore add the in-line defect organizer operation if needs. • Increase the DOI Capture Rate: After recipe optimization, defects of interesting capture rate increases due to suppress the nuisance of metal grain. Unique defect types are found after suppressing the nuisance. • Implement Into Other Layers: Back-end Cu Process & Font-end Poly-silicon also can implement the same methodologies to suppress the nuisance of grain.
机译:•先进的明田检测工具:先进的明亮场检测工具可以提供更好的WPH,更少的时间来设置配方,更高的敏感性好处。然而,金属谷物抑制仍然是检查的大挑战。 •金属晶粒抑制:证明了抑制金属晶粒的系列方法,表明金属晶粒抑制不能通过单一方法实现。它需要找出可行的光源并优化一个步骤调谐扫描段阈值设置,此外,如果需要,添加了在线缺陷组织器操作。 •增加DOI捕获率:在配方优化后,有趣的捕获率的缺陷由于抑制了金属谷物的滋扰。在抑制滋扰后发现了独特的缺陷类型。 •实施进入其他层:后端CU工艺和Font-End Poly-Silicon还可以实现相同的方法来抑制谷物的滋扰。

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