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Reliability Evaluation of Conformal Coatings for Tin Whisker Failure Mitigation in Accelerated Testing Conditions

机译:加速试验条件下锡晶须失效的保形涂层可靠性评价

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Tin whisker growth has become a reliability concern during the course of Pb-free solder transition. A common mitigation strategy is to use conformal coatings to prevent electrical shorts by tin whiskers. However, recent research indicates that under elevated temperature and humidity, or in areas of thin covering, whiskers can grow and penetrate conformal coatings. Additionally, for long environmental exposure, the effectiveness of conformal coatings may be compromised. The main objective of this work is thus to develop a test procedure (1) to determine the initial adhesive and cohesive strengths of an applied coating and (2) to subsequently assess the rate of degradation under accelerated testing conditions for long-term evaluation. We propose a blister-type test method to assess both the adhesive and cohesive strengths of conformal coatings. The proposed approach offers unique advantages. The testing method mimics actual tin whisker growth and allows for a quantitative comparison of the adhesive and cohesive strengths of the coating. In addition, blister test specimens can be subjected to harsh environments, which make this test perfect for accelerated testing. In the typical blister test of adhesive strength, pressure is applied through a hole in a substrate. As the pressure is increased, the coating layer on top of the substrate will begin to bulge out like a blister. The blister will continue to grow until it reaches a maximum blister height, at which point delamination will occur [1]. In a modified blister test for cohesive strength, a thin film coating will be fixed between two copper substrates. A ramp pressure will be applied to the hole in the lower substrate until the blister reaches a critical height, at which point the film will fail due to rupture. The typical blister tests of coating layers are marred by the presence of large scatter in their results, making the quantitative assessment of adhesion difficult, and the ability to distinguish the effects of environmental exposure even more challenging. In the proposed study a novel concept to create a pre-defined initial crack diameter is proposed and implemented to reduce deviation in test results. Two common conformal coatings, silicone rubber and urethane, were selected for testing. Preliminary experimental results indicate that silicone coating samples fail due to the limited
机译:锡晶须增长已成为无铅焊料过渡过程中的可靠性问题。共同的缓解策略是使用共形涂层来防止锡晶片的电气短路。然而,最近的研究表明,在升高的温度和湿度下,或薄覆盖区域,晶须可以生长和渗透整合涂层。另外,对于长的环境暴露,可以损害保形涂层的有效性。因此,本作作品的主要目的是开发一种测试程序(1)以确定施加的涂料和(2)的初始粘合剂和内聚强度,以便在加速测试条件下评估降解速率,以进行长期评价。我们提出了一种泡罩型试验方法,以评估保形涂层的粘合剂和粘性强度。该拟议的方法提供了独特的优势。测试方法模拟实际锡晶须生长,并允许涂层的粘合剂和粘合强度的定量比较。此外,泡罩试样可以进行恶劣环境,这使得该测试完美地用于加速测试。在粘合强度的典型泡罩试验中,通过基板中的孔施加压力。随着压力增加,基板顶部的涂层将开始像泡罩一样膨胀。泡罩将继续生长,直到它到达最大泡罩高度,此时将发生点分层[1]。在用于粘性强度的改进的泡罩测试中,薄膜涂层将在两个铜基材之间固定。斜坡压力将施加到下基板中的孔,直到泡罩达到临界高度,此时膜由于破裂而导致的薄膜将失效。涂层层的典型泡罩试验通过在其结果中存在大散射的存在,使得对粘合性的定量评估困难,以及区分环境暴露影响更具挑战性的能力。在提出的研究中,提出并实施了创建预定义初始裂缝直径的新颖概念,以降低测试结果的偏差。选择两个常见的共形涂层,硅橡胶和氨基甲酸酯,用于测试。初步实验结果表明,由于有限的硅胶涂层样品失效

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