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The Low Electrical Resistivity of the High-entropy Alloy Oxide Thin Films

机译:高熵合金氧化物薄膜的低电阻率

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This paper reports the new compositions of oxide thin films with very low electrical resistivity. We have found that some of the high-entropy alloy oxide thin films which still had very low electrical resistivity. In this study, we deposited the thin films of Ti_xFeCoNi (x=0, 0.25, 0.5, 0.75 and 1), TiFeCoNiCu_x (x=1, 2 and 3), and Al_xCrFeCoNiCu (x=0.5 and 1) by PVD, all the targets were prepared by arc-melting under Ar atmosphere. The microstructures of the specimens were examined by SEM and TEM; the electrical resistivities of the specimens were measured by four-point probe equipment. Results indicated the microstructures of the as-deposited alloy thin films were amorphous. All of the thin films were oxidized and became to semiconductors after annealed by vacuum furnace, also their microstructures transformed to nanocrystalline FCC microstructures. The electrical resistivities of these high entropy alloy oxides were about 30 μΩ-cm for the Ti_xFeCoNi oxide thin films, about 100 μΩ-cm for the TiFeCoNiCu_3 oxide thin film and about 650 μΩ-cm for the Al_(0.5)CrFeCoNiCu oxide thin film. That is, we found the new compositions of oxides with very low electrical resistivity. This is the most important result of this study, and it could also be very important contribution to the electrical ceramics.
机译:本文报道了具有非常低的电阻率的氧化物薄膜的新组合物。我们已经发现,一些高熵合金氧化物薄膜仍然具有非常低的电阻率。在这项研究中,我们沉积了Ti_xfeconi的薄膜(x = 0,0.25,0.5,0.75和1),tifeconicu_x(x = 1,2和3),Al_xcrefeconicu(x = 0.5和1)通过PVD,所有通过在AR气氛下熔化制备靶标。通过SEM和TEM检查标本的微观结构;通过四点探针设备测量样品的电阻率。结果表明,沉积的合金薄膜的微观结构是无定形的。通过真空炉退火后,将所有薄膜氧化并变为半导体,其微观结构转化为纳米晶FCC微结构。对于Ti_xFeconi氧化物薄膜,这些高熵合金氧化物的电阻率为约30μΩ-cm,对于Tifeconicu_3氧化物薄膜约100μΩ-cm,对于Al_(0.5)CRFeconicu氧化物薄膜,约为650μΩ-cm。也就是说,我们发现具有非常低的电阻率的氧化物的新组合物。这是本研究中最重要的结果,它对电气陶瓷也可能是非常重要的贡献。

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