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Sn whisker growth in Cu(top)-Sn(bottom) bilayer system upon room temperature aging

机译:SN晶须Cu(顶部)-SN(底部)双层系统在室温老化时

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The Sn whisker growth in Cu(top)-Sn(bottom) bilayer system upon room temperature aging was investigated by scanning electron microscope and X-ray diffraction techniques. The experimental observations indicate that the Sn whisker growth on the Cu surface in Cu-Sn bilayer system is different from that on the Sn surface in Sn-Cu bilayer system. When the Sn sublayer thickness is less than 0.5μm, the Sn whisker growth can take place in Cu-Sn system but not in Sn-Cu system. An explanation for Sn whisker growth in Cu-Sn bilayer system is given.
机译:通过扫描电子显微镜和X射线衍射技术研究了室温老化时Cu(顶部)-Sn(底部)双层系统的SN晶须生长。实验观察表明,Cu-Sn双层系统中Cu表面上的Sn晶须生长与Sn-Cu双层系统中的Sn表面上的Cu表面不同。当Sn子层厚度小于0.5μm时,SN晶须生长可以在Cu-Sn系统中进行,但不在SN-Cu系统中进行。给出了Cu-Sn双层系统SN晶须生长的解释。

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