Synthesis and Cure Kinetic Studies of a New Trifunctional Imide Oligomer

摘要

A novel phenylethynyl-terminated imide oligomer was prepared from a trifunctional amine and 4-phenylethynylphthalic anhydride (PEPA). The oligomer can be used to prepare the high performance resin-based composite material via resin transfer molding (RTM) due to its low melt viscosity(<2Pa.s) between 250°C and 320°C.The cured resin exhibits excellent thermal stability than PETI series as a result of the introduction of star-branched units. The thermal analysis of the curing kinetics of resin was carried out by differential scanning calorimetry (DSC), with the rate of cure reaction and the degree of cure calculated in the dynamic mode and being tested under isothermal conditions. A reasonable agreement between the experimental data and the kinetic model has been obtained over the whole processing temperature range which was important for processing simulation and quality control of processing for high performance composite.