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Thermoelectric properties of Cu and Sb co-doped Ga-Te based semiconductor with wide band gap

机译:具有宽带隙Cu和Sb共掺杂GA-TE半导体的热电性能

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As a p-type semiconductor, Ga2Te5 has very low Seebeck coefficient and thermal conductivity. Cu, Sb co-doped Ga2Te5 based semiconductor was prepared by spark plasma sintering technique, and its band gap was measured decreasing from AEg//=1.77 eV represented by intrinsic state to 1.50 eV. X-ray analysis reveals the material crystallizes in the main phase Ga2Te5, but with Ga2Te3 and Sb2Te3 minor phases precipitated. The Seebeck coefficient increases from 150 (μV/K) to 275 (μV/K.) with temperature elevation, while the electrical conductivity decrease from 5.2xl0~1 (Ω~(-1), m~(-1)) to 2.4xl0~3 (Ω~(-1), m~(-1)), but still much higher than that of single crystal of Ga2Te5 reported at the corresponding temperature. The great improvement of electrical properties is closely related to the band gap narrowing, even though the impurity phases precipitated can influence the measured band gap value. The highest ZT value of 0.21 was obtained at 631 K for the Cu, Sb co-doped Ga2Te5 based semiconductor.
机译:作为p型半导体,Ga2te5具有非常低的塞贝克系数和导热率。 Cu,通过火花等离子体烧结技术制备Sb共掺杂Ga2Te5的半导体,通过固有状态表示的AEG // = 1.77 eV从AEG // 1.77 EV测量其带隙。 X射线分析显示材料在主相Ga2te5中结晶,但是通过Ga2te 3和Sb2te 3次级沉淀。塞贝克系数随温度升高的150(μV/ k)至275(μV/ k)增加,而电导率从5.2×10〜1(ω〜(-1),m〜(-1))降至2.4 XL0〜3(ω〜(-1),m〜(-1)),但仍然远高于在相应温度下报告的Ga2te5的单晶。即使沉淀的杂质相位可以影响测量的带隙值,电气性质的巨大改善与带隙变窄密切相关。在Cu,Sb共掺杂GA2Te5的半导体中以631K获得的最高ZT值为0.21。

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