Monitoring plating thickness is critical. Multiple test methods are available including MMS instruments. Now, phosphorous content and thickness of electroless nickel can be measured simultaneously and in air (vacuum free) regardless of the underlying base material, AL, Fe, Cu or PCB using XRF. Plating applications such as Ni, Zn, Cu can be measured with hand held instruments. Data documentation is streamlined via inspection plans and custom report generation.
展开▼