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PAST, PRESENT AND FUTURE OF SOLDERLESS ASSEMBLY

机译:无焊组件的过去,现在和未来

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The forced transition to lead-free soldering foisted on the global electronics industry by a well meaning but misguided European parliament has actually resulted, according to the US EPA study, in a net worsening of the environment. One prospective response to the ongoing challenge facing the electronics industry is to eliminate solder from the electronic interconnection process. The concept is one that has deep roots in the electronics industry and it is now of growing interest to electronic product developers, especially among those in the military, aerospace and automotive markets but also in the portable electronics market. This paper will examine some of the many different methods that have been proposed or used over the years by the electronics industry and take a look forward at some solutions that might lie in the future
机译:根据美国环保署的研究,强迫过渡到全球电子行业,误导欧洲议会实际上导致了欧洲议会的初步导致了环境。对电子行业面临的持续挑战的一项潜在回应是消除电子互连过程的焊料。该概念是电子工业中有深层根深蒂固的概念,它现在对电子产品开发商的感兴趣越来越兴趣,特别是军事,航空航天和汽车市场的兴趣,以及便携式电子市场。本文将研究电子行业多年来提出或使用的许多不同方法,并期待在未来可能撒谎的一些解决方案

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