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Analysis about Crafts and Technologies of Low-PIM and PIM Interference Testing System

机译:低PIM和PIM干扰检测系统工艺与技术分析

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Main low-PIM crafts were summarized, such as material requirements of major devices and special requirements of electroplating process. The setting up technologies of a PIMI testing system was discussed, for example reducing the number of connectors, isolators being used to prevent active IM and requirements of subsystem and receiver being given. Based on those crafts and technologies, a PIMI testing system was setting up with a design goal of 3rd residual PIM being -165dBc@2x43dBm. It achieved the goal with -165 dBc through actual measuring after calibration.
机译:总结了主要的低PIM工艺品,如主要装置的材料要求和电镀过程的特殊要求。讨论了PIMI测试系统的设置技术,例如减少连接器的数量,用于防止用于防止有源IM的隔离器和子系统和接收器的要求。根据这些工艺品和技术,PIMI测试系统正在建立第3次残留PIM的设计目标--165DBC @ 2X43DBM。它通过校准后的实际测量实现了与-165 dbc的目标。

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