Novel Inspection Technique to Detect Copper Residues and Surface Height Variations for Post Backside Grind and Post TSV Reveal Steps - (PPT)

摘要

Detection of surface residues and height nonuniformities is a needed inspection. ChemetriQ Inspection can deliver fast, full-wafer detection of yield critical NVDs: Post Backside Grind; Post TSV Via Reveal; other TSV Process Steps; Residues; Height; Charge. Results on the SEMATECH project using CMP reveal highlighted key defect issues: Copper residues; Surface height nonuniformities.