3D package solutions now account for a significant portion (~20%) of all die area processed today. Most all of this is still assembled in standard package configurations (FBGA, SO, MicroSD, etc) using wirebond interconnect. This paper will look at the many current technologies that have been adopted to enable 3D, and understand what the next steps will be to enable true die to die interconnection in a cost effective manner. Recent examples of various technologies from Fan-out WL-CSP, TSV for image sensors and MEMS, and other 3D concepts will be shown to highlight advantages and disadvantages of these emerging technologies. Prismark's roadmap for 3D adoption will be compared to previous new technology roadmaps to demonstrate the history of older technologies' ability to hang on to market share.
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