Femtosecond Lasers for Machining of Transparent, Brittle Materials: Ablative vs. Non-Ablative Femtosecond Laser Processing

摘要

This paper focuses on precision machining of transparent materials by means of ablative and non-ablative femtosecond laser processing. Ablation technology will be compared with a newly developed patent pending non-ablative femtosecond process, ClearShape?, using the Spectra-Physics~? Spirit~? industrial femtosecond laser.