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The thermal conductivity of LED under the influence of vacuumsputtering films

机译:在真空灰尘膜的影响下LED的导热率

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摘要

The thermal conductivity has the important influence in quantum effect of light emitting diodes (LED) especially in high brightness light emitting diodes (HB LED). One of the biggest challenges is efficient heat transfer from PCB to aluminum plate when it base on printed circuit board (PCB). Because it enables transfer the heat from electric device to the aluminum plate, which completely removes the heat. In this study, alumina (Al203), alumina nitride (A1N) and zinc sulfide (ZnS) films soldered the HB LED lamps to enhance the heat transfer. All of the films were fabricated onto 1070 aluminum substrate by vacuum sputtering technology. The dielectric coatings were characterized by several subsequent analyses, especially the measurement of thermal resistance. The X-Ray diffraction (XRD) diagram analysis reveals three kinds of ceramic thin films were successfully grown on the individual substrate. Moreover, the alumina nitride coating has low sheet resistivity, high hardness, high critical load, and good thermal conduction, 200 W/m-K, as compared to those of Al203 and ZnS films.
机译:导热率对发光二极管(LED)的量子效应具有重要影响,尤其是在高亮度发光二极管(HB LED)中。其中一个最大的挑战是当其基于印刷电路板(PCB)时从PCB到铝板的有效热传递。因为它使得能够将热量从电气设备转移到铝板,其完全去除热量。在该研究中,氧化铝(Al203),氧化铝氮化物(A1N)和硫化锌(ZnS)膜焊接Hb LED灯以增强传热。通过真空溅射技术制造在1070铝基底上的所有薄膜。介电涂层的特征在于几种后续分析,尤其是热阻的测量。 X射线衍射(XRD)图分析显示出三种陶瓷薄膜在各个基材上成功生长。此外,与Al203和ZnS膜相比,氧化铝涂层具有低薄层电阻率,高硬度,高临界负荷和良好的热传导,200w / m-k。

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