Updated Results of RD on Functionally Innovative 3D-Integrated Circuit (Dream Chip) Technology in FY2009 - (PPT)

摘要

Development Themes i)-A R&D on Design Environment Technology; i)-B R&D on Interposer Technology; ii)-A R&D on Chip Test Technology; i)-B R&D on Cooling and Stacking/Bonding Technology; ii)-C R&D On Thin Wafer Technology; iii)-A R&D on Demonstration Devices Design and Process Development; v)-A R&D on Architecture and Design Technology for 3D Reconfigurable Device; v)-B R&D on 3D Integration Technology for 3D Reconfigurable Device; Vi)-A R&D on Multi-Band Variable RF MEMS Device Technology; Vi)-B R&D on Multi-Band Communication Front End Circuit.