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Contrasting Topologies for Regular Interconnection Networks under the Constraints of Nanoscale Silicon Technology

机译:纳米级硅技术约束下定期互连网络的对比拓扑

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摘要

Nowadays, system designers have adopted Networks-on-Chip as communication infrastructure of general-purpose tile-based Multi-Processor System-on-Chip (MPSoC). Such decision implies that a certain topology has to be selected to efficiently interconnect many cores on the chip. To ease such a choice, the networking literature offers a plethora of works about topology analysis and characterization for the off-chip domain. However, theoretical parameters and many intuitive assumptions of such off-chip networks do not necessarily hold when a topology is laid out on a 2D silicon surface. This is due to the distinctive features of silicon technology design pitfalls. This work is a first milestone to bridge this gap, in fact, we propose a comprehensive analysis framework to assess K-ary n-mesh and C-mesh topologies at different level of abstractions, from system to layout level, while capturing implications of system and layout parameters across design hierarchy. When a certain topology proves to be slow due to long links crossing the chip, pipeline stages have been inserted to cope with such slow-down. Furthermore, costs of such speed-up technique have been evaluated to draw a comprehensive performance/area figure.
机译:如今,系统设计人员已采用芯片上的网络作为通用瓷砖多处理器系统(MPSOC)的通信基础设施。这种决定意味着必须选择某种拓扑以有效地互连芯片上的许多核心。为了简化这样的选择,网络文献提供了关于片外域的拓扑分析和表征的多种作品。然而,当在2D硅表面上布置拓扑时,这种片外网络的理论参数和许多直观的假设不一定保持。这是由于硅技术设计陷阱的独特特征。这项工作是第一个弥合这种差距的里程碑,实际上,我们提出了一个全面的分析框架,以评估不同水平的抽象水平的K-ARY N-Mesh和C-Mesh拓扑,从系统到布局级别,同时捕获系统的含义和跨设计层次结构的布局参数。由于在穿过芯片的长链路时,某种拓扑被认为缓慢,插入管道阶段以应对这种缓慢。此外,已经评估了这种加速技术的成本,以绘制综合性能/区域图。

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