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Preparation and properties of p-type transparent conductive NiO films

机译:p型透明导电NiO膜的制备与性能

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The NiO-Cu composite films with various Cu contents of 0 - 18.17 at.% are deposited on glass substrate. An ultra high electrical resistivity (ρ) is obtained and cannot be detected by four point probe measurement when the Cu contents in the films are lower than 6.97 at.%. The ρ value is reduced significantly to 35.8Ω-cm as Cu content is increased to 9.18 at.%, and it further decreases to 0.02Ω-cm when the Cu content further increases to 18.17 at.%. The Hall measurement for all Cu-doped NiO films show p-type conduction. In addition, the transmittance of NiO films also decreases continuously from 96% to 43% as Cu content increases from 0 to 18.17 at.%. The XRD patterns of Cu-doped NiO films only appear NiO peaks and the crystallinity of NiO films becomes worse as Cu content is added to above 6.97 at.%. Large amount of lattice sites of Ni~(2+) ions in NiO crystalline are replaced by the Cu~+ ions that leads to p-type conduction and result in the degradation of crystallinity for NiO-Cu composite films having higher Cu content.
机译:具有各种Cu含量为0-18.17的NiO-Cu复合膜。%沉积在玻璃基板上。获得超高电阻率(ρ),当薄膜中的Cu含量低于6.97时,不能通过四点探针测量来检测。%。 ρ值显着降低至35.8Ω-cm,因为Cu含量增加到9.18%。%,当Cu含量进一步增加至18.17时,它进一步降至0.02Ω-cm。%。所有Cu掺杂的NiO膜的霍尔测量显示P型传导。此外,当Cu含量从0〜18.17增加时,NiO膜的透射率也连续降低96%至43%。%。 Cu掺杂的NiO膜的XRD图案仅出现NiO峰,当Cu含量加入到6.97时,NiO膜的结晶度变差。%。 Ni〜(2+)离子中的大量晶格位点由NiO结晶中的Cu〜+离子替换,所述Cu〜+离子导致p型导电,并导致具有较高Cu含量的NiO-Cu复合膜的结晶度降解。

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