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Investigation of Aluminum-boron Doping Profiles Formed by Coalloying from Screen-printed Pastes

机译:从丝网印刷浆料贴合面形成的铝 - 硼掺杂型材的研究

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We present a detailed study on aluminum-boron doping profiles formed in silicon by alloying from screen-printed aluminum pastes containing boron additives. We show that an increase in the effective peak temperature T_(peak, eff) (determined from phase diagram calculations) of the alloying process leads to higher concentrations of both Al and B atoms within the alloyed p~+ region, resulting in (i) higher potential barriers for electrons, but also (ii) increased densities of recombination-active Al defects. While the improved potential barrier predominates for T_(peak,eff) approx < 770 °C, the increased defect density prevails for T_(peaic,eff) approx > 800 °C, thus defining an optimal effective peak temperature. Furthermore, we show that, by increasing the amount of elemental B added to the paste, the acceptor concentration can be increased without affecting the defect density. Therefore, the optimal printing and firing conditions comprise high B amounts and low, adapted effective peak temperatures. For a B content of 0.9 wt% and T_(peak,eff)= 765 °C, we have achieved a saturation current density of 253 fA/cm~2, corresponding to an implied open-circuit voltage of 665 mV, which demonstrates the high potential of B additives within Al pastes to further improve the efficiency of Si solar cells with Al-alloyed p~+ rear.
机译:我们通过含硼添加剂的丝网印刷的铝浆料合金化了解硅 - 硼掺杂型材的详细研究。我们表明,合金化方法的有效峰值温度T_(峰值,EFF)(从相形计算中确定的峰值)的增加导致合金P〜+区域内的Al和B原子的浓度较高,导致(i)对于电子的潜在屏障,而且(ii)的重组活性Al缺陷的密度增加。虽然T_改进的势垒占优势(峰值,EFF)约<770℃,T_增加的缺陷密度盛行(peaic,EFF)约> 800℃,从而限定一个最佳有效峰值温度。此外,我们表明,通过增加添加到糊剂的元素B的量,可以增加受体浓度而不会影响缺陷密度。因此,最佳印刷和烧制条件包括高B量和低,适应性的有效峰值温度。为0.9%(重量)和T_(峰,EFF)B含量= 765℃,我们已经实现了253 FA /厘米〜2的饱和电流密度,对应于665毫伏的一个隐含的开路电压,这表明内的Al乙添加剂的高电位粘贴以进一步改善硅太阳能电池的用Al合金p〜+后方的效率。

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