The development of microsystem technology is combined with an increasing complexity of the signal and technology system. High demands for long term stability of the electrical signal quality have to conform with the demand for smaller size of the complete system module and lower cost. Customer and application specific solutions are of crucial importance. Smart systems integrated products are not only a result of scaled down chip sizes, gaps, housing and contacts. Miniaturization means increasingly an overlapping of technology steps of the silicon wafer processing and the assembly technique. This offers a potential for integration of new functionalities and improved signal qualities as well. Two examples for such systems with special requirements are an optical inclination sensor and a capacitive condensation sensor package.
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