Producing photovoltaic modules from mono- or multi-crystalline silicon wafers, comprises affixing each silicon wafer to a carrier using vacuum, ceramic adhesive/frame, and carrying the silicon wafer on one side or each side of the carrier

摘要

The method for producing photovoltaic modules from mono- or multi-crystalline silicon wafers, comprises affixing each silicon wafer to a carrier using vacuum, ceramic adhesive or a frame, carrying the silicon wafer on one side or each side of the carrier, and fitting a number of carriers on a common rail thus creating a carrier rack The silicon wafers are electrically connected in parallel or in series, loosened from their carriers, and placed onto transparent and durable sheets such as glass sheets, which are a front side of a solar module. The carrier rack is formed as a tray. The method for producing photovoltaic modules from mono- or multi-crystalline silicon wafers, comprises affixing each silicon wafer to a carrier using vacuum, ceramic adhesive or a frame, carrying the silicon wafer on one side or each side of the carrier, and fitting a number of carriers on a common rail thus creating a carrier rack. The silicon wafers are electrically connected in parallel or in series, loosened from their carriers, and placed onto transparent and durable sheets such as glass sheets, which are a front side of a solar module. The carrier rack is formed as a tray, which cooperates with frame for keeping the silicon wafer, fitted to a conveyer belt or a conveyer chain, and placed in lines. The carriers are made of a material withstanding up to 1000[deg] C and having a good chemical stability, where the material is stainless steel, other metals, ceramic material or composite material. The silicon wafers have a thickness of 0.05-0.15mm. The adhesive is placed in small cavities or strings on the carrier. The cavities are essentially placed in a circle. The strings have a rectangular cross-section area, and comprise electrically conducting means. The carriers are fitted with a hole under each silicon wafer to be used for inlet of gas under pressure for loosening the silicon wafers from the carriers. The method further comprises cleaning, surface etching, phosforisation, edge isolation, etching to get rid of phosphorous silicates, nitration and screen printing.