Finite Element Simulation and Micro Deformation Measurements - Contributions to the Development of Advanced Packages with Hidden Dies

摘要

High functionality and reliability of new advanced electronic products requires as many as possible loading conditions to be taken into account such as can be expected during manufacturing, testing, storage, and operation. This is not only related to the electrical properties but also to the thermal as well as the thermo-mechanical design. For this purpose, numerical studies by means of finite element (FE) analyses are very efficient to investigate the desired properties. In addition, the deformation of suitable test structures with respect to appropriate thermal and/or mechanical loading conditions can be measured with the microDAC methodology, developed by CWM and Fraunhofer IZM/ENAS. This way, a thermal and thermo-mechanical optimisation can be achieved before any real parts are available for test. This approach will be outlined here in principle as well as applied to several examples. It can be generalised and applied to many design procedures even before prototypes are available.