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The Development of a Design Procedure and Usage Criteria for Hot Applied Chip Seal Applications

机译:用于热应用芯片密封应用的设计程序和使用标准的开发

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This paper will discuss the various hot applied and highly modified field blended hinder materials that are currently being manufactured in the United States and utilized in chip and cape seal pavement preservation applications. These pavement preservation systems serve as alternatives to expensive construction or re-construction techniques. Further discussion will focus on a specific chip seal design method which includes binder design and aggregate retention testing to determine materials compatibility prior to a project being constructed Binder and aggregate application rates, proper aggregate quality and gradation, along with other construction issues and procedures; including traffic volume and climatic region are variables that will also be considered as part of this "design "process.
机译:本文将讨论目前在美国制造的各种热应用和高度修改的场混合阻碍材料,并用于芯片和斗篷密封路面保存应用。这些路面保护系统用作昂贵的结构或重新施工技术的替代品。进一步的讨论将专注于特定的芯片密封设计方法,包括粘合剂设计和骨料保留测试,以确定项目在构建粘合剂之前的材料兼容性,以及综合施用率,适当的综合质量和渐变以及其他施工问题和程序;包括交通量和气候区域是变量,也将被视为“设计”过程的一部分。

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