CuPc-based TFTs with high-k dielectric ZrO2 as gate dielectric prepared by RF magnetron sputtering with various Ar/O2 ratios have been fabricated. The effects of oxygen concentration in the sputtering ambient on the electrical performance of the devices are investigated. This work finds that increasing oxygen concentration in the sputtering ambient up to a Ar/O2 ratio of 4:1 can improve the OTFT performance including the mobility, sub-threshold slope and on/off ratio. On the other hand, further increasing the Ar/O2 ratio to 4:3 is found to degrade the device performance. This demonstrates that the electrical characteristics of the devices depend strongly on the oxygen concentration in the sputtering ambient. The origin of this phenomenon is discussed.
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机译:基于CUPC的TFT具有高k电介质ZRO 2 INF>作为由RF磁控管溅射制备的栅极电介质,具有各种AR / O 2 IM>比率。研究了溅射环境对器件电性能的氧浓度的影响。该工作发现,将溅射环境中的氧气浓度增加到AR / O 2 INF>比例为4:1可以改善包括迁移率,子阈值斜率和开/关比的OTFT性能。另一方面,发现进一步将AR / O 2 INF>比率的比率降低了4:3来降低器件性能。这表明器件的电特性强烈地依赖于溅射环境中的氧浓度。讨论了这种现象的起源。
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