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RF Modeling of 45nm Low-Power CMOS Technology

机译:45nm低功耗CMOS技术的RF造型

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In this paper, we present an advanced RF modeling work for our state of the art 45nm low power CMOS technology. Based on carefully designed structures, we extracted a rigorous, hardware based wiring capacitance model that accurately computes each component of the wirecap network on top of the intrinsic FET. A novel, scalable substrate resistance model was created to well fit relevant hardware data. To obtain accurate on wafer s parameter data for the modeling structures at high frequencies (up to 110GHz), we adopted sophisticated deembedding techniques such as Pad Open Short and COMPLETE. The results clearly show that our models well match various RF characteristics for devices with a broad range of sizes and measured at different voltage biases. Undoubtedly, these high quality RF FET models offer circuit designers an indispensable and powerful tool to best utilize our advanced RFCMOS technology.
机译:在本文中,我们为我们的技术最先进的RF建模工作提供了45nm低功率CMOS技术。基于精心设计的结构,我们提取了一种严格的硬件基布线电容模型,可准确计算IntrinciC FET上的WIRECAP网络的每个组件。创建了一种新颖的可伸缩的衬底电阻模型,以良好适应相关的硬件数据。为了在高频(高达110GHz)的建模结构上获得准确的晶片S参数数据(高达110GHz),我们采用了复杂的防守技术,如垫片开放简短,完整。结果清楚地表明,我们的模型很好地匹配具有宽范围尺寸的设备的各种RF特性,并在不同的电压偏差下测量。毫无疑问,这些高品质的RF FET模型提供了电路设计人员是一个不可或缺的强大的工具,可以最好地利用我们先进的RFCMOS技术。

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