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Trench IGBT with Carrier Bypass Region

机译:带有载体旁路区域的沟槽IGBT

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摘要

A new Trench IGBT with carrier bypass region is proposed in paper. In this new structure, P+ bypass regions are introduced, which provided hole carrier bypass, reduced the parasitic thyristor effect in the Trench IGBT, allowed higher safe operating area. The results are shown that the temperature characteristic of the new Trench IGBT is better than that of the conventional Trench IGBT. The metal which contacts the bypass regions and the emitters helps the thermal dissipation at high temperature and reduces the emitter contact resistance.
机译:用纸上提出了一种具有载体旁路区域的新沟槽IGBT。在这种新结构中,引入了P +旁路区域,该旁路区域提供孔载体旁路,降低了沟槽IGBT中的寄生晶体管效应,允许更高的安全操作区域。结果表明新沟槽IGBT的温度特性优于传统沟槽IGBT的温度特性。接触旁路区域和发射器的金属有助于在高温下进行热量耗散,并降低发射极接触电阻。

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