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Compact 60-GHz antenna-in-package with end-fire radiation

机译:紧凑型60-GHz天线封装,具有端火辐射

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In this paper a 60 GHz antenna-in-package with end-fire radiation in LTCC is presented. Compared with the method mounting the chip on the side of the antenna package, the proposed antenna-in-package (AiP) configuration carries the chip on top of it to greatly save the area of RF front-end. In addition, the symmetric posts are introduced to widen the bandwidth. The metal match rings are added to smooth the S11. The results indicate, the proposed AiP can operate from 60.4 GHz to 62.7 GHz with the maximum gain of 6.25 dBi at 60 GHz.
机译:在本文中,提出了一种60 GHz天线,具有LTCC的端射辐射。 与安装在天线封装侧的芯片上的方法相比,所提出的天线(AIP)配置在其顶部承载芯片,以大大地保存RF前端的区域。 此外,引入了对称帖子以扩大带宽。 添加金属匹配环以平滑S11。 结果表明,所提出的AIP可以从60.4GHz到62.7GHz运行,60 GHz的最大增益为6.25 dBi。

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