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Antenna-in-package structures with broadside and end-fire radiations
Antenna-in-package structures with broadside and end-fire radiations
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机译:具有宽边辐射和端射辐射的封装天线结构
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摘要
Package structures are provided having antenna-in-packages that are integrated with semiconductor RFIC (radio frequency integrated circuit) chips to form compact integrated radio/wireless communications systems that operate in the millimeter wave (mmWave) frequency range with radiation in broadside and end-fire directions.
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