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Wireless power transfer using resonant inductive coupling for 3D integrated ICs

机译:用于3D集成IC的谐振电感耦合的无线电力传输

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In this paper we introduce a wireless power transfer scheme using resonant inductive coupling for 3DICs to enhance power transfer efficiency and power transfer density with smaller coils. Numerical analysis and optimal conditions are presented for both power transfer efficiency and density. HFSS simulation results are shown to verify the theoretical results. Coils for the power link are designed using a Chartered 0.13μm CMOS process. The peak power transfer efficiency is 52% and power transfer density is 49mW/mm2.
机译:在本文中,我们将使用用于3DICS的谐振电感耦合来引入无线电力传输方案,以提高电力传递效率和具有较小线圈的动力传递密度。介绍了数值分析和功率传递效率和密度的最佳条件。 HFSS仿真结果显示验证理论结果。用于电源连杆的线圈使用特许0.13μmCMOS工艺设计。峰值动力传递效率为52%,电力传递密度为49mW / mm 2

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