Microelectromechanical Systems (MEMS) are intensivly studied since many years due to their high potential performances and their integration possibilities. In particular, electromechanical resonators realized at the CMOS level could allow the emergence of integrated multi-frequency architectures suitable for future multiband wireless communication devices that might require many reference frequencies to address multiple communication standards. This paper presents a new 3D multi-frequency MEMS resonator design based on Lame-mode plate resonators. Mechanisms and Finite Element Modeling (FEM) simulations are detailed. The Silicon on Nothing process (SoN) can be used to realize such 0-stress 3D structures.
展开▼
