Examining internal gas compositions of a variety of microcircuit package types ages with a focus on sources of internal moisture

摘要

The primary cause of corrosion, stiction or other failure mechanisms within hermetically sealed enclosures has historically been viewed as due to increases in internal moisture concentrations. It has historically been postulated that the primary source of moisture in these enclosures is the failure to achieve hermeticity at seal, or the loss of hermeticity post-seal. This postulation is the basis for failure analysis and mitigation both in the appropriate standards like MILSTD- 883 and in industrial QA procedures. Empirical observation of many data sets over the past 20+ years shows that this postulation does not always hold up in practice. The purpose of the current work is to test this postulation through the analysis of archival microelectronic packages and data sets of various ages.